High-Performance Speed Controller Module for Electric Vehicles, Multi-Axis Drones, and DIY Electric Skateboards – Perfect for RC Models, DIY Projects, and High-Speed Racing

Feature:1. PCB adopts immersion gold thickening process, designed with 6‑layer PCB LAYou, each layer of copper foil thickness is 3OZ.2. Immersion gold sunroof in key parts of PCB increases heat dissipation and over‑current process, which makes the overall effect better.3. A spark‑proof switch function is added to the front of the power supply to protect the power contact and the electronic components of the integrated circuit to avoid sparks that may cause explosion.4. Use MIC5219‑3.MY instead of LM3671 chip to increase the current from 600MA to 500MA x 2=1000A to obtain a more stable current output.5. A aviation aluminum alloy shell is added, the thermal silica gel is matched with the heat sink to enhance the heat dissipation performance of the ESC. The shell surface is anodized to prevent scratches.Specification:Item Type: Electric Speed ControllerMaterial: aviation aluminum alloy + thermal silicaModel: Single drive v6 with shellThe firmware version of FSESC6.6 is VESC_default_no_hw_limits, which is compatible with for Benjamin VESC TOOL and can be used for models, multi-axis aircraft, electric vehicles, electric skateboards, smart cars, robots and simple industrial position control.Specification: Hardware: V 6.6Firmware: Latest firmware versionVoltage: 8V-60V (3S to 12S LiPo safety)Peak voltage must not exceed 60VCurrent: Continuous 60A, instantaneous current 150A. The value depends on the temperature and air circulation around the device5V 1.5A output for external electronic equipment3.3V 1A output for external electronic equipmentMode: DC, BLDC, FOC (sine waving)Supported Sensors: ABI, HALL, AS5047Motor Wire: 12AWGIncludes sp

A aviation aluminum alloy shell is added, the thermal silica gel is matched with the heat sink to enhance the heat dissipation performance of the ESC. The shell surface is anodized to prevent scratches.

Use MIC5219‑3.MY instead of LM3671 chip to increase the current from 600MA to 500MA x 2=1000A to obtain a more stable current output.

A spark‑proof switch function is added to the front of the power supply to protect the power contact and the electronic components of the integrated circuit to avoid sparks that may cause explosion.

PCB adopts immersion gold thickening process, designed with 6‑layer PCB LAYou, each layer of copper foil thickness is 3OZ.

Immersion gold sunroof in key parts of PCB increases heat dissipation and over‑current process, which makes the overall effect better.